High dynamic range pixel amplifier

Abstract

A pixel cell with increased dynamic range is formed by providing a floating diffusion region having a variable capacitance, controlled by at least one gate having source and drain regions commonly connected to the floating diffusion region. The gate has an intrinsic capacitance which, when the gate is activated, is added to the capacitance of the floating diffusion region, providing a low conversion gain readout. When the gate is off, the floating diffusion region capacitance is minimized, providing a high conversion gain readout. The gate may also be selectively switched to mid-level. At mid-level, a mid-level conversion gain, which is between the high and low conversion gains, readout is provided, but the gate still provides some capacitance to prevent the floating diffusion region from saturating.

Claims

1 . A pixel cell comprising: a photosensor; a floating diffusion region for receiving charges from said photosensor; and at least one gate coupled to said floating diffusion region and having an intrinsic capacitance, said at least one gate being selectively operable to change the capacitance of said floating diffusion region. 2 . The pixel cell of claim 1 , wherein said photosensor is selected from the group consisting of a photodiode, photogate, and photoconductor. 3 . The pixel cell of claim 1 , wherein a first readout of said floating diffusion region at a first floating diffusion capacitance is a low sensitivity readout, where the intrinsic capacitance of said at least one gate is added to said capacitance of said floating diffusion region when said at least one gate is on. 4 . The pixel cell of claim 1 , wherein a second readout of said floating diffusion region at a second floating diffusion capacitance is a high sensitivity readout, where the intrinsic capacitance of said at least one gate is removed from said capacitance of said floating diffusion region when said at least one gate is off. 5 . The pixel cell of claim 1 , further comprising a circuit for receiving a first pixel output signal generated by said first readout and a second pixel output signal generated by said second readout and combining said first and second pixel output signals to provide a single pixel signal. 6 . The pixel cell of claim 1 , wherein a portion of the intrinsic capacitance of said at least one gate is added to said capacitance of said floating diffusion region. 7 . The pixel cell of claim 6 , wherein a single readout is taken after the at least one gate has been selectively changed to add said portion of its intrinsic capacitance to said capacitance of said floating diffusion region. 8 . The pixel cell of claim 1 , wherein said gate has a commonly connected source/drain region. 9 . The pixel cell of claim 8 , wherein said source/drain region is in electrical communication with said floating diffusion region. 10 . A pixel cell comprising: a photosensor; a switch having a gate structure and a commonly connected source/drain region; and a floating diffusion region for receiving charges collected by said photosensor during a charge integration period, said commonly connected source/drain region of said switch being in electrical communication with said floating diffusion region. 11 . The pixel cell of claim 10 , wherein said photosensor is selected from the group consisting of a photodiode, photogate, and photoconductor. 12 . The pixel cell of claim 11 , further comprising a circuit for selectively operating said switch by applying a first voltage to said gate structure. 13 . The pixel cell of claim 12 , wherein said circuit for selectively operating said switch further applies a second voltage to said gate circuit, which is lower than said first voltage. 14 . The pixel cell of claim 13 , wherein said second voltage is approximately midway between said first voltage and a voltage that disables the switch. 15 . The pixel cell of claim 13 , further comprising a first readout circuit for obtaining a first pixel output signal taken when said switch is switched on and a second pixel output signal taken when said switch is switched off. 16 . The pixel cell of claim 15 , wherein said first and second pixel output signals are generated from the charges collected during a same charge integration period of said photosensor. 17 . The pixel cell of claim 15 , wherein said switch increases a capacitance of said floating diffusion region when switched on. 18 . The pixel cell of claim 15 , wherein said switch boosts a charge on said floating diffusion region when said switch is turned off. 19 . The pixel cell of claim 15 , further comprising a circuit for receiving said first and second pixel output signals and combining said first and second pixel output signals to provide a single pixel signal. 20 . The pixel cell of claim 14 , wherein a portion of an intrinsic capacitance of said switch is added to a capacitance of said floating diffusion region when said second voltage is applied to said switch. 21 . The pixel cell of claim 20 , wherein a conversion gain of said pixel cell decreases when said second voltage is applied to said switch. 22 . A pixel cell comprising: a photosensor; and a floating diffusion region for receiving charges integrated by said photosensor during an integration period; at least a first gate structure provided adjacent to said floating diffusion region for selectively changing the capacitance of said floating diffusion region. 23 . The pixel cell of claim 22 , wherein at least said first gate structure has an intrinsic capacitance. 24 . The pixel cell of claim 23 , wherein the capacitance of said floating diffusion region changes in a single integration period. 25 . The pixel cell of claim 24 , wherein at least said first gate structure increases said variable capacitance of said floating diffusion region by adding at least a portion of the intrinsic capacitance of at least said first gate structure to said capacitance of said floating diffusion region. 26 . The pixel cell of claim 25 , wherein a first voltage is applied to at least said first gate structure to turn at least said first gate structure on at a first portion of said single integration period. 27 . The pixel cell of claim 26 , wherein a second voltage, which is lower than the first voltage, is applied to at least partly turn at least said first gate structure off at a second portion of said single integration period. 28 . The pixel cell of claim 27 , wherein at least said first gate structure decreases said capacitance of said floating diffusion region by removing at least a portion of said intrinsic capacitance of at least said first gate structure from said capacitance of said floating diffusion region. 29 . The pixel cell of claim 27 , wherein said second voltage is set to completely turn said gate structure off. 30 . The pixel cell of claim 29 , wherein a first pixel output signal is taken during said first portion of said single integration period and a second pixel output signal is taken during said second portion of said single integration period. 31 . The pixel cell of claim 30 , wherein said first and second pixel output signals are combined to provide a single pixel output signal. 32 . The pixel cell of claim 27 , wherein said second voltage is approximately midway between said first voltage and a voltage that disables at least said first gate structure. 33 . The pixel cell of claim 32 , wherein a pixel output signal is taken during said second portion of said single integration period. 34 . The pixel cell of claim 27 , wherein said first voltage is applied to at least a second gate structure having an intrinsic capacitance to turn at least said second gate structure on at said first portion of said single integration period. 35 . The pixel cell of claim 34 , wherein a third voltage, which is lower than the second voltage, is applied to at least partly turn at least said second gate structure off at a second portion of said single integration period. 36 . The pixel cell of claim 35 , wherein at least said first and second gate structure decrease said capacitance of said floating diffusion region by removing at least a portion of the capacitances of at least said first and second gate structures from said capacitance of said floating diffusion region. 37 . The pixel cell of claim 36 , wherein a pixel output signal is taken during said second portion of said single integration period. 38 . A pixel cell comprising: a photosensor; a floating diffusion region for receiving charges from said photosensor; and a first gate coupled to said floating diffusion region, operable to provide a variable conversion gain to a pixel output signal in a readout period in accordance with a switched state of said first gate. 39 . The pixel cell of claim 38 , wherein said first gate provides a low conversion gain when said first gate is on by adding an intrinsic capacitance of said gate to a capacitance of said floating diffusion region. 40 . The pixel cell of claim 39 , wherein said first gate provides a high conversion gain when said gate is off and said intrinsic capacitance of said first gate is not combined with said capacitance of said floating diffusion region. 41 . The pixel cell of claim 39 , wherein said first gate provides a high conversion gain when a voltage is applied to said first gate and a portion of said intrinsic capacitance of said first gate is added to said capacitance of said floating diffusion region, wherein said voltage is approximately midway between said first voltage and ground. 42 . The pixel cell of claim 38 further comprising at least a second gate coupled to said first gate and said floating diffusion region, wherein said first and at least said second gates provide a low conversion gain when said first and at least said second gates are on by adding intrinsic capacitances of said gates to a capacitance of said floating diffusion region. 43 . The pixel cell of claim 42 , wherein said first and at least said second gates provide a high conversion gain when a first voltage is applied to said first gate such that a portion of said intrinsic capacitance of said first gate is added to said capacitance of said floating diffusion region and a second voltage is applied to at least said second gate such that a portion of said intrinsic capacitance of at least said second gate is added to said capacitance of said floating diffusion region, wherein said second voltage is between said first voltage and ground. 44 . An imager system, comprising: a processor; and an imaging device coupled to said processor, said imaging device comprising: a pixel array, each pixel in the pixel array comprising: a photosensor; a floating diffusion region for receiving charges from said photosensor; and at least a first gate coupled to said floating diffusion region, operable to provide a variable conversion gain to a pixel output signal in a readout period in accordance with a switched state of at least said first gate. 45 . The imager system of claim 44 , wherein said pixel array is a CMOS pixel array. 46 . The imager system of claim 44 , wherein said pixel array is a CCD pixel array. 47 . The imager system of claim 44 , wherein at least said first gate provides a low conversion gain when a first voltage is applied to at least said first gate by adding an intrinsic capacitance of at least said first gate to a capacitance of said floating diffusion region. 48 . The imager system of claim 47 , wherein said at least said first gate provides a high conversion gain when at least said first gate is off and said intrinsic capacitance of at least said first gate is not combined with said capacitance of said floating diffusion region. 49 . The imager system of claim 47 , wherein at least said first gate provides a high conversion gain when at least a second voltage is applied to at least said first gate, wherein said second voltage is between said first voltage and ground. 50 . A method of fabricating a pixel cell, comprising: forming a photosensor on a substrate; forming a floating diffusion region on said substrate; and forming a gate capacitor over said substrate having a source and a drain region, said source and drain region of said gate capacitor being commonly connected to said floating diffusion region. 51 . The method of claim 50 , wherein at least a portion of a gate of said gate capacitor is formed adjacent to said floating diffusion region. 52 . The method of claim 51 further comprising connecting a voltage source to said gate of said gate capacitor for operating said gate capacitor. 53 . A method of operating a pixel cell, comprising: generating charges with a photosensor during an integration period; turning on a gate coupled to a storage node, said gate having intrinsic capacitance; transferring charges from said photosensor to said storage node; providing a first pixel output signal based on charges at said storage node with said gate on; turning said gate off; and taking a second pixel output signal based on charges at said storage node when said gate is off. 54 . The method of claim 53 , wherein said step of transferring charges from said photosensor removes substantially all charge from said photosensor. 55 . The method of claim 53 , wherein said step of turning said gate off boosts charges in said storage node. 56 . The method of claim 53 further comprising combining said first and second pixel output signals to produce a combined pixel output signal. 57 . The method of claim 56 , wherein said first and second pixel output signals are generated from charges in a single photosensor integration period. 58 . A method of operating a pixel cell, comprising: generating charges with a photosensor during an integration period; increasing a storage capacity of a storage node connected to said photosensor; transferring charges from said photosensor to said storage node; and selectively decreasing said storage capacity of said storage node. 59 . The method of claim 58 , wherein said step of transferring charges from said photosensor removes substantially all charge from said photosensor. 60 . The method of claim 58 further comprising providing a first pixel output signal based on charges at said storage node after transferring charges from said photosensor. 61 . The method of claim 60 further comprising taking a second pixel output signal based on charges at said storage node after selectively decreasing said storage capacity of said storage node. 62 . The method of claim 61 , wherein said storage capacity of said storage node is selectively decreased by decreasing a voltage applied to a gate coupled to said storage node. 63 . The method of claim 62 , wherein said gate is turned off to decrease said storage capacity of said storage node. 64 . The method of claim 63 further comprising combining said first and second output signals to produce a combined pixel output signal. 65 . The method of claim 58 , wherein a knee is created in a charge-voltage graph of said pixel cell. 66 . The method of claim 65 further comprising taking a reading after selectively decreasing said storage capacity of said storage node and calculating an output signal based on said knee. 67 . A pixel cell comprising at least one gate at least partially adjacent to a floating diffusion region and selectively operable to change the charge to voltage relationship for an output signal of said pixel cell. 68 . The pixel cell of claim 67 , wherein said pixel cell comprises at least a first gate and a second gate. 69 . The pixel cell of claim 68 , wherein the charge to voltage relationship for said output signal changes in a single integration period. 70 . The pixel cell of claim 68 , wherein at least said first gate is turned on during a first portion of said integration period. 71 . The pixel cell of claim 70 , wherein at least said first gate is turned off during a second portion of said integration period. 72 . The pixel cell of claim 70 , wherein said first gate is turned off and said second gate is turned to a mid-level during a second portion of said integration period. 73 . The pixel cell of claim 68 , wherein said first gate is turned to a first level between on and off and said second gate is turned to a second level between said first level and off. 74 . A pixel cell comprising at least one gate at least partially adjacent to a floating diffusion region, and obtaining Vrst, Vsig 1 , and Vsig 2 from said pixel cell, wherein Vsig 1 is taken when said at least one gate is in a first state, and Vsig 2 is taken when said at least one gate is in a second state. 75 . The pixel cell of claim 74 , wherein the output signal is read out as a combination of Vrst, Vsig 1 , and Vsig 2 . 76 . The pixel cell of claim 75 , wherein the output signal is read out as Vrst−(Vsig 1 +Vsig 2 )/2. 77 . The pixel cell of claim 75 , wherein the output signal is read out as Vrst-Vsig 1 . 78 . The pixel cell of claim 75 , wherein the output signal is read out as Vrst-Vsig 2 . 79 . The pixel cell of claim 75 , wherein the output signal is read out as Vsig 1 . 80 . The pixel cell of claim 75 , wherein the output signal is read out as Vsig 2 . 81 . The pixel cell of claim 75 , wherein one of Vsig 1 and Vsig 2 is selected for providing the output signal to read out as (Vrst-Vsig 1 ) or (Vrst-Vsig 2 ).
FIELD OF THE INVENTION [0001] The invention relates to the field of semiconductor devices and, in particular, to a high dynamic range pixel amplifier for an imager. BACKGROUND OF THE INVENTION [0002] A CMOS imager circuit includes a focal plane array of pixel cells, each cell includes a photosensor, for example, a photogate, photoconductor or a photodiode overlying a substrate for producing a photo-generated charge in a doped region of the substrate. A readout circuit is provided for each pixel cell and includes at least a source follower transistor and a row select transistor for coupling the source follower transistor to a column output line. The pixel cell also typically has a floating diffusion node, connected to the gate of the source follower transistor. Charge generated by the photosensor is sent to the floating diffusion region. The imager may also include a transistor for transferring charge from the photosensor to the floating diffusion node and another transistor for resetting the floating diffusion region node to a predetermined charge level prior to charge transference. Each pixel cell is isolated from other pixel cells in the array by a field oxide region (STI) which surrounds it and separates the doped regions of the substrate within that pixel cell from the doped regions of the substrate within neighboring pixel cells. [0003] In a CMOS imager, the active elements of a pixel cell, for example a four transistor pixel, perform the necessary functions of (1) photon to charge conversion; (2) resetting the floating diffusion node to a known state before the transfer of charge to it; (3) transfer of charge to the floating diffusion node; (4) selection of a pixel cell for readout; and (5) output and amplification of a signal representing a reset voltage and a pixel signal voltage based on the photo converted charges. The charge at the floating diffusion node is converted to a pixel output voltage by a source follower output transistor. [0004] FIG. 1 illustrates a block diagram of a CMOS imager device 100 having a pixel array 110 with each pixel cell being constructed as described above. The pixel array 110 comprises a plurality of pixels arranged in a predetermined number of columns and rows. The pixels of each row in the array 110 are all turned on at the same time by a row select line, and the pixels of each column are selectively output by respective column select lines. A plurality of row and column lines are provided for the entire array 110 . The row lines are selectively activated by a row driver 145 in response to a row address decoder 155 . The column select lines are selectively activated by a column driver 160 in response to a column address decoder 170 . Thus, a row and column address is provided for each pixel. [0005] The CMOS imager 100 is operated by a control circuit 150 that controls address decoders 155 , 170 for selecting the appropriate row and column lines for pixel readout, and row and column driver circuitry 145 , 160 that apply driving voltage to the drive transistors of the selected row and column lines. The pixel column signals, which typically include a pixel reset signal Vrst and a pixel image signal Vsig for each row selected pixel in a column are read by sample and hold circuitry 161 associated with the column device 160 . A differential signal Vrst-Vsig is produced for each pixel, which is amplified and digitized by analog-to-digital converter 175 . The analog-to-digital converter 175 converts the analog pixel signals to digital signals that are fed to an image processor 180 to form a digital image output. [0006] Exemplary CMOS imaging circuits, processing steps thereof, and detailed descriptions of the functions of various CMOS elements of an imaging circuit are described, for example, in U.S. Pat. No. 6,140,630, U.S. Pat. No. 6,376,868, U.S. Pat. No. 6,310,366, U.S. Pat. No. 6,326,652, U.S. Pat. No. 6,204,524, and U.S. Pat. No. 6,333,205, assigned to Micron Technology, Inc. The disclosures of each of the forgoing patents are hereby incorporated by reference in their entirety. [0007] A schematic diagram of an exemplary CMOS pixel four-transistor (4T) pixel cell 10 is illustrated in FIG. 2 . The four transistors include a reset transistor 34 , source follower transistor 36 , row select transistor 38 and a transfer transistor 32 . A photosensor 40 converts incident light into a charge. A floating diffusion region 50 receives charge from the photosensor 40 through the transfer transistor 32 and is connected to the reset transistor 34 and the source follower transistor 36 . The source follower transistor 36 outputs a signal proportional to the charge accumulated in the floating diffusion region 50 to a sampling circuit when the row select transistor 38 is turned on. The reset transistor 34 resets the floating diffusion region 50 to a known potential prior to transfer of charge from the photosensor 40 and this reset signal is output and sampled by the sampling circuit. The photosensor 40 may be a photodiode, a photogate, or a photoconductor. If a photodiode is employed, the photodiode may be formed below a surface of the substrate and may be a buried PNP photodiode, buried NPN photodiode, a buried PN photodiode, or a buried NP photodiode, among others. [0008] Image sensors, such as an image sensor employing the conventional pixel cell 10 , have a characteristic dynamic range. Dynamic range refers to the range of incident light that can be accommodated by an image sensor in a single frame of pixel data. It is desirable to have an image sensor with a high dynamic range to image scenes that generate high dynamic range incident signals, such as indoor rooms with windows to the outside, outdoor scenes with mixed shadows and bright sunshine, night-time scenes combining artificial lighting and shadows, and many others. [0009] The dynamic range for an image sensor is commonly defined as the ratio of its largest non-saturating signal to the standard deviation of the noise under dark conditions. The dynamic range is limited on an upper end by the charge saturation level of the sensor, and on a lower end by noise imposed limitations and/or quantization limits of the analog-to-digital converter used to produce the digital image. When the dynamic range of an image sensor is too small to accommodate the variations in light intensities of the imaged scene, e.g., by having a low saturation level, image distortion occurs. [0010] In a conventional CMOS pixel imager with a photodiode, the photodiode converts incident light to an electrical charge. The photodiode accumulates this charge throughout an integration period. At the end of the integration period, the transfer gate is activated, and the charge is transferred from the photodiode to the floating diffusion region. [0011] When the incident light is of low-intensity such that the charge transferred from the photosensor to the floating diffusion region is low, the signal is very faint. In such a case, it is desirable for the conversion gain (i.e., the ratio of output voltage to input charge) to be high. When the incident light is of high-intensity such that the charge transferred from the photosensor to the floating diffusion region is greater than the capacity of the floating diffusion region, excess charge may overflow and saturate the pixel cell. In such a case, it is desirable that the conversion gain be low. [0012] However, with conventional imagers, the floating diffusion regions in a pixel array have a fixed capacitance, which means a fixed conversion gain. That is, for a single integration period, all pixel signals are provided with the same conversion gain. As a result, some pixels may saturate while others may provide a faint signal, limiting the dynamic range of the image sensor. Thus, there is a desire and need for a pixel cell capable of selectively attaining a high conversion gain or a low conversion gain to increase the dynamic range of the image sensor. BRIEF SUMMARY OF THE INVENTION [0013] The present invention provides a pixel cell capable of selectively attaining a high or low conversion gain. [0014] In one exemplary embodiment of the invention, a pixel cell is provided which includes a floating diffusion region with a variable capacitance controlled by a gate, having its own intrinsic capacitance. The source and drain regions of the gate are coupled to the floating diffusion region. When the gate is on, the capacitance of the gate is added to that of the floating diffusion region, effectively increasing the capacitance of the floating diffusion region. When the gate is off, the capacitance of the gate is no longer combined with that of the floating diffusion region, thereby reducing the capacitance of the floating diffusion region to solely the floating diffusion region capacitance. [0015] The pixel cell is capable of providing two or more different non-destructive readouts of the same image signal from the same integration. One readout is taken with the gate on, a second readout is taken with the gate off. This switchability allows the floating diffusion region to have a greater capacitance in the case of high-intensity light or a lower capacitance in the case of low-intensity light. The benefit of having a floating diffusion region with a greater capacitance when the incident light has high intensity is that it provides a lower conversion gain, and thus lower sensitivity readout. Conversely, the floating diffusion may have a lower capacitance when the incident light is of low intensity, providing a higher conversion gain, and thus higher sensitivity readout. The two readouts may be combined to provide a single pixel output signal having a desired level of conversion gain, or one of the pixel output signals can be discarded and the other used during image processing. [0016] In another exemplary embodiment, the gate may also be switched to a mid-level (between the on and off states), where the voltage applied to it is approximately midway between an on-voltage and ground. When the gate is at mid-level, a portion of the capacitance of the gate is added to that of the floating diffusion region if the voltage on the floating diffusion region is a threshold voltage below the mid-level gate voltage. This embodiment implements a variable capacitor with built-in threshold in a single transistor, providing a knee in the output charge-voltage profile of a pixel. The knee, created at a desired mid-level voltage, permits high conversion gain for low-intensity light situations and low conversion gain for high-intensity light situations. The kneepoint may be adjusted by adjusting the gate voltage. In this embodiment, a single readout is taken. [0017] In other exemplary embodiments of the present invention, a switchable gate having intrinsic capacitance is coupled to a floating diffusion region at various locations and in various arrangements relative to the floating diffusion region. BRIEF DESCRIPTION OF THE DRAWINGS [0018] These and other features and advantages of the invention will be better understood from the following detailed description, which is provided in connection with the accompanying drawings, in which: [0019] FIG. 1 is a block diagram of an imaging device; [0020] FIG. 2 is a schematic diagram of a four-transistor (4T) pixel; [0021] FIG. 3 is a schematic diagram of an exemplary five-transistor (5T) pixel of the invention; [0022] FIG. 4 a is a plan view of a pixel cell according to an embodiment of the invention; [0023] FIG. 4 b is a plan view of a pixel cell according to another embodiment of the invention; [0024] FIGS. 5A and 5B are cross sections of the pixel cell of FIG. 4A , taken along line 5 A- 5 A and 5 B- 5 B, respectively; [0025] FIGS. 6A-6D are potential diagrams of the pixel cell of FIG. 4A having a near-full well; [0026] FIGS. 6 C′- 6 D′ are charge-voltage graphs of a pixel cell of the embodiment of FIGS. 6A-6D of the present invention; [0027] FIGS. 7A-7D are potential diagrams of the pixel cell of FIG. 4A having a near-empty well; [0028] FIGS. 8A-8D are potential diagrams of the pixel cell of FIG. 4A having a near-empty well, where the booster switch is switched to a mid-level; [0029] FIGS. 8E-8H are potential diagrams of the pixel cell of FIG. 4A having a partly-full well; [0030] FIG. 9 is a charge-voltage graph of a pixel cell of the embodiment of FIGS. 8A-8H of the present invention; [0031] FIG. 10 is a schematic diagram of an exemplary six transistor (6T) pixel of the invention; [0032] FIGS. 11A-11D are potential diagrams of the pixel cell of FIG. 10 , where the booster switches are switched to different levels; [0033] FIG. 12 is a charge-voltage graph of a pixel cell of the embodiment of FIGS. 11A-11D of the present invention; [0034] FIG. 13 shows a camera device incorporating at least one pixel cell constructed in accordance with an embodiment of the invention; and [0035] FIG. 14 shows a processor system incorporating at least one camera device constructed in accordance with an embodiment of the invention. DETAILED DESCRIPTION OF THE INVENTION [0036] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized, and that structural, logical and electrical changes may be made without departing from the spirit and scope of the present invention. [0037] The term “pixel” refers to a photo-element unit cell containing a photoconversion device or photosensor and transistors for processing an electrical signal from electromagnetic radiation sensed by the photoconversion device. The pixels discussed herein are illustrated and described as inventive modifications to four transistor (4T) pixel circuits for the sake of example only. It should be understood that the invention is not limited to a four transistor (4T) pixel, but may be used with other pixel arrangements having fewer (e.g., 3T) or more (e.g., 5T) than four transistors. Although the invention is described herein with reference to the architecture and fabrication of one pixel, it should be understood that this is representative of a plurality of pixels in an array of an imager device. In addition, although the invention is described below with reference to a CMOS imager, the invention has applicability to any solid state imaging device having pixels, such as a CCD or other imager. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims. [0038] Referring now to the drawings, where like elements are designated by like reference numerals, FIG. 3 illustrates a schematic diagram of an exemplary five-transistor (5T) pixel 20 circuit embodiment of the invention. Pixel 20 has all the elements of the prior art pixel 10 shown in FIG. 2 , including a transfer gate 32 (TG), reset transistor 34 , source follower transistor 36 , row select transistor 38 , photosensor 40 (PD), and floating diffusion region 50 (FD). As with the pixel 10 of prior art, the photosensor 40 may be a photodiode, a photogate, or a photoconductor. Pixel 20 also includes a novel booster switch 51 (BS). [0039] Booster switch 51 has an intrinsic capacitance and is provided to selectively increase the capacitance of the floating diffusion region 50 . The booster switch 51 is a gate having source and drain terminals commonly connected to the floating diffusion region 50 and is designed to selectively change the capacitance of the floating diffusion region 50 at least once in a single integration period. The degree to which the booster switch 51 increases the capacitance of the floating diffusion region 50 is controlled by a circuit that supplies a voltage being applied to the gate of the booster switch 51 . [0040] FIGS. 4A and 4B illustrate respective plan views of two exemplary pixel cell embodiments of the present invention 20 , 20 ′ having different layout configurations. FIG. 4A illustrates pixel cell 20 including a transfer gate 32 , reset transistor 34 , source follower transistor 36 , row select transistor 38 , photosensor 40 , and floating diffusion region 50 . Pixel cell 20 also has a booster switch 51 fabricated as a gate positioned parallel to the transfer gate 32 . The pixel cell 20 ′ of FIG. 4B also includes a transfer gate 32 , reset transistor 34 , source follower transistor 36 , row select transistor 38 , photosensor 40 ′, floating diffusion region 50 ′, and booster switch 51 ′. However, the photosensor 40 ′ of FIG. 4B has an extended region 41 past the transfer gate 32 such that the booster switch 51 ′ may be positioned perpendicular to the transfer gate 32 . In the illustrated embodiments, the booster switches 51 , 51 ′ sit respectively adjacent to the floating diffusion regions 50 , 50 ′. FIGS. 5A and 5B are cross sectional views of the pixel cell 20 of FIG. 4A taken along lines 5 A- 5 A and 5 B- 5 B, respectively. The booster switch 51 shown in FIG. 5B has a gate structure 54 and source and drain regions which are commonly connected to the floating diffusion region 50 , as shown in FIG. 5A . The operation of these components is illustrated and discussed below with respect to the potential diagrams of FIGS. 6-8 . [0041] Referring to the substrate potential diagrams of FIGS. 6-8 , the labels PD, TG, BS and FD are used to represent regions of the photosensor 40 , transfer gate 32 , booster switch 51 , and floating diffusion region 50 , respectively. At the outset, and referring back to FIG. 3 , reset transistor 34 is turned on to reset the floating diffusion region 50 to a known state, which is read out by source follower transistor 36 through an “on” row select transistor 38 onto output line Vout. During the reset of the floating diffusion region, it may be beneficial to have the booster switch 51 voltage at ground to reduce kTC noise component in the high conversion gain range of operation. In the low conversion gain range of operation, the noise will be dominated by photon noise. Next, and now also referring to FIG. 6A , charge is generated and accumulated by the photosensor 40 (PD) during an integration period. The transfer gate 32 (TG) is off and a first voltage is applied to the booster switch 51 (BS). The voltage turns the booster switch 51 (BS) on, providing the floating diffusion region 50 (FD) with a combined capacitance, including its own inherent capacitance and that of the booster switch 51 (BS). When the transfer gate 32 (TG) is then switched on after charge integration, as shown in FIG. 6B , the charge is transferred from the photosensor 40 (PD), through the transfer gate 32 (TG), and into the booster switch 51 (BS) and floating diffusion region 50 (FD). A small amount of charge is also stored in the transfer gate 32 (TG). [0042] The transfer gate 32 (TG) is then switched off, as shown in FIG. 6C , and the residual amount of charge in the channel of the transfer gate 32 (TG) is transferred to the booster switch 51 (BS) and floating diffusion region 50 (FD). Substantially all of the photogenerated charge is now stored in the booster switch 51 (BS) and floating diffusion region 50 (FD). At this time, a first pixel image output reading may be taken through the row select transistor for the pixel and sampling the pixel output signal Vout ( FIG. 3 ). This produces a first pixel image output signal Vsig 1 . Vsig 1 is read along the charge-voltage profile shown in FIG. 6C ′. [0043] After the first output reading is taken, the voltage applied to the booster switch 51 (BS) is then brought to ground, turning the booster switch 51 (BS) completely off, as shown in FIG. 6D . Any charge stored in the booster switch 51 (BS) is transferred to the floating diffusion region 50 (FD), such that all of the photogenerated charge is stored in the floating diffusion region 50 (FD) alone. At this time, a second pixel output signal Vout reading may be taken to produce a second pixel image output signal Vsig 2 . Vsig 2 is read along the charge-voltage profile shown in FIG. 6D ′. [0044] The first pixel output reading Vsig 1 is a low sensitivity readout, even where the photosensor is nearly fully-saturated as shown in FIG. 6A . Since the booster switch 51 (BS) increases the capacitance of the floating diffusion region 50 (FD) by adding its own capacitance, the charge does not exceed the charge storage capacity of the floating diffusion region 50 (FD), as shown in FIG. 6C . This is also indicated in FIG. 6C ′, where the slope of the charge-voltage profile is inversely proportional to the sum of the capacitance of the booster switch and the capacitance of the floating diffusion region. This provides a low conversion gain reading for the pixel, which is beneficial for a nearly fully-saturated pixel, as the following discussion will demonstrate. [0045] The second pixel output reading Vsig 2 is a high sensitivity readout. Once the booster switch 51 (BS) is switched off, as shown in FIG. 6D , the floating diffusion region 50 (FD) may saturate. Since the booster switch 51 (BS) is off, the entire charge is captured on the floating diffusion region 50 (FD) and may overflow. This lower storage capacity is indicated in FIG. 6D ′, where the slope of the charge-voltage profile is inversely proportional to the charge storage capacity of the floating diffusion region alone. Comparing the charge-voltage profiles of FIGS. 6 C′ and 6 D′, it is apparent that the pixel will reach saturation and begin to overflow at a lower level of photogenerated charge in the case of FIG. 6D ′, where the slope of the charge-voltage profile is steeper. However, in the present invention, since the low conversion gain reading was taken prior to saturation of the floating diffusion region 50 (FD), the high light intensity signal is not lost as a result of the overflow. [0046] The pixel readings Vrst, Vsig 1 , and Vsig 2 may be combined in different ways. The combined signal can be digitized by an analog to digital converter, e.g., ADC 175 of FIG. 1 , and sent to an image processor, e.g., image processor 180 of FIG. 1 . For example, signals Vrst-Vsig 1 and Vrst-Vsig 2 can be produced, digitized, and sent to an image processor. Other possible combinations of the pixel read out are [Vrst−(Vsig 1 +Vsig 2 )/2] or Vrst can be combined with just one of Vsig 1 and Vsig 2 in accordance with a control signal from the image processor to produce Vrst-Vsig 1 or Vsrst-Vsig 2 , which is digitized and fed to the image processor. [0047] Another example of the two-stage reading method is illustrated in FIGS. 7A-7D , in the case where the photosensor 40 (PD) is nearly empty after charge integration, i.e., where there is a low level of incident light. After reset and dim charge integration, charge is generated and accumulated by the photosensor 40 (PD), as shown in FIG. 7A . The transfer gate 32 (TG) is off while a first voltage is applied to the booster switch 51 (BS). The voltage turns the booster switch 51 (BS) on, providing the floating diffusion region 50 (FD) with a combined capacitance, including its own inherent capacitance and that of the booster switch 51 (BS). When the transfer gate 32 (TG) is switched on after the integration period, the charge is transferred from the photosensor 40 (PD), through the transfer gate 32 (TG), and into the booster switch 51 (BS) and floating diffusion region 50 (FD), as shown in FIG. 7B . A small amount of charge is also stored in the transfer gate 32 (TG). [0048] The transfer gate 32 (TG) is then switched off, as shown in FIG. 7C , and the residual amount of charge in the channel of the transfer gate 32 (TG) is transferred to the booster switch 51 (BS) and floating diffusion region 50 (FD). Ali of the photogenerated charge is stored in the booster switch 51 (BS) and floating diffusion region 50 (FD) combined. At this time, the first pixel output reading Vsig 1 may be taken. As shown in FIG. 7C , the first pixel output reading will be faint, or low, since the capacitance of the booster switch 51 (BS) and floating diffusion region 50 (FD) combined is far greater than the charge being sampled. However, once the booster switch 51 (BS) is turned off, the entire charge is captured on the floating diffusion region 50 (FD), thereby boosting the second pixel output reading Vsig 2 , as shown in FIG. 7D . In this case, a high conversion gain reading is provided and a higher pixel output signal is obtained. [0049] In both illustrated cases, whether the level of incident light is high or low, the first and second pixel output readings may be combined to provide a single pixel output signal having a desired level of conversion gain, or one of the two signal output signals can be used as the pixel output signal for image processing. [0050] In another operational embodiment of the present invention depicted in FIGS. 8A-8H , only one pixel output reading is taken. FIGS. 8A-8D depict the potential diagram in a low intensity light setting, where the charge generated and accumulated by the photosensor 40 (PD) is low. As shown in FIG. 8A , the charge in the photosensor 40 (PD) is low, the transfer gate 32 (TG) is off, and a first voltage is applied to the booster switch 51 (BS). The voltage turns the booster switch 51 (BS) on, providing the floating diffusion region 50 (FD) with a combined capacitance, including its own inherent capacitance and that of the booster switch 51 (BS). When the transfer gate 32 (TG) is switched on, the charge is transferred from the photosensor 40 (PD), through the transfer gate 32 (TG), and into the booster switch 51 (BS) and floating diffusion region 50 (FD), as shown in FIG. 8B . A small amount of charge is also stored in the transfer gate 32 (TG). [0051] The transfer gate 32 (TG) is then switched off, as shown in FIG. 8C , and the residual amount of charge in the channel of the transfer gate 32 (TG) is transferred to the booster switch 51 (BS) and floating diffusion region 50 (FD). All of the photogenerated charge is stored in the booster switch 51 (BS) and floating diffusion region 50 (FD) combined. [0052] It is important to note that the present invention can remove charge-sharing lag, caused by a high pin voltage (Vpin). For a high dynamic range pixel, the full well of the floating diffusion region must at least match the fill well of the photosensor, the full well of the photosensor being the product of area and Vpin. In the field of imager semiconductor devices, minimized area is desirable. Therefore, in order to minimize area and still accommodate the full well of the photosensor, Vpin must be maximized, thus causing charge-sharing lag in a 4T pixel cell. [0053] The present invention prevents charge-sharing lag while permitting a high Vpin by adding a booster switch and running it at a high voltage during charge transfer across the transfer gate, thereby providing a high capacitance floating diffusion region. Note that, but for charge-sharing lag, the circuit as described with a booster switch would work with a constant voltage on the booster switch as well as with a change in voltage on the booster switch. By pulsing the booster switch between supply (Vaa) and an intermediate voltage, a high Vpin can be tolerated without causing lag. Without pulsing the booster switch, the area of the photosensor would limit the dynamic range of the pixel. [0054] After the photogenerated charge has been transferred to the booster switch 51 (BS) and floating diffusion region 50 (FD), as shown in FIG. 8C , the voltage applied to the booster switch 51 (BS) may be lowered approximately midway between the first voltage and ground. In the case where the photogenerated charge is low due to low intensity light, all the charge is transferred from the booster switch 51 (BS) such that only the capacitance of the floating diffusion region 50 (FD) is used to store the charge, as shown in FIG. 8D . At this time, the pixel output reading may be taken. [0055] According to this operation, the output reading is taken when the booster switch gate voltage is brought to a mid-level, which is designed to create a knee in the charge-voltage profile, as shown in FIG. 9 . The term “knee” reflects the fact that an angle in the pixel output charge-voltage profile is created, as there are now two different conversion gains and charge-voltage profile regions with different slopes, one corresponding to charges which are only in the floating diffusion region, e.g., FIG. 8D , and the other corresponding to when the charge is of sufficient magnitude to flow into the gate capacitance region as well, e.g., FIG. 8H . Thus, the “knee” provides high conversion gain for low signals and low conversion gain for high signals. [0056] Turning to FIG. 9 , the first segment 61 of the charge-voltage profile below the knee reflects the higher conversion gain of the pixel when the booster switch is on, but the light intensity is low. The slope of the first segment 61 is inversely proportional to the capacitance of the floating diffusion region. A Vsig 1 reading along the first segment 61 represents the voltage output for a low level of charge stored by capacitance of the floating diffusion region alone, despite the fact that the booster switch is at mid-level. When there is a higher level of charge (high intensity light setting), the Vsig 1 reading will be along the second segment 62 above the knee. The second segment 62 has a slope that is inversely proportional to the sum of the capacitance of the floating diffusion region and the capacitance of the booster switch. The second segment 62 has a less-steep slope than the first segment 61 , which reflects a lower conversion gain, where the capacitance of the booster switch at mid-level is engaged by storing some of the charge in the booster switch as well as in the floating diffusion region. [0057] FIGS. 8E-8H illustrate the present embodiment in a high intensity light setting, where the charge generated and accumulated by the photosensor 40 (PD) is high. As shown in FIG. 8E , the charge in the photosensor 40 (PD) is high, the transfer gate 32 (TG) is off, and a first voltage is applied to the booster switch 51 (BS). The voltage turns the booster switch 51 (BS) on, providing the floating diffusion region 50 (FD) with a combined capacitance, including its own inherent capacitance and that of the booster switch 51 (BS). When the transfer gate 32 (TG) is switched on, the charge is transferred from the photosensor 40 (PD), through the transfer gate 32 (TG), and into the booster switch 51 (BS) and floating diffusion region 50 (FD), as shown in FIG. 8F . A small amount of charge is also stored in the transfer gate 32 (TG). [0058] The transfer gate 32 (TG) is then switched off, as shown in FIG. 8G , and the residual amount of charge in the channel of the transfer gate 32 (TG) is transferred to the booster switch 51 (BS) and floating diffusion region 50 (FD). All of the photogenerated charge is stored in the booster switch 51 (BS) and floating diffusion region 50 (FD) combined. [0059] After the photogenerated charge has been transferred to the booster switch 51 (BS) and floating diffusion region 50 (FD), as shown in FIG. 8G , the voltage applied to the booster switch 51 (BS) may be lowered approximately midway between the first voltage and ground. In the case where the photogenerated charge is high due to high intensity light, some of the capacitance of the booster switch 51 (BS) that was being combined with the capacitance of the floating diffusion region 50 (FD) is removed from the combined capacitance. Some of the charge is transferred from the booster switch 51 (BS) to the floating diffusion region 50 (FD) and some of the charge stays in the booster switch 51 (BS), as shown in FIG. 8H . At this time, the pixel output reading may be taken. [0060] The readout voltage for the charge generated from a high intensity light setting will be in the second segment 62 , as shown in FIG. 9 , where the charge is stored in both the floating diffusion region and the booster switch at mid-level. The output voltage is calculated by extrapolating the readout voltage to segment 63 . The segment 63 reflects the value of the charge-voltage profile of the floating diffusion region alone, which, without the knee created by the booster switch, would exceed the output capability of the pixel at a lower level of charge. The knee decision point can be adjusted by adjusting the decrease in voltage applied the booster switch 51 . [0061] Having additional booster switches may further enhance the dynamic range of the pixel. More than one booster switch may be coupled to the floating diffusion region. FIG. 10 illustrates a schematic diagram of a six-transistor (6T) pixel 20 circuit embodiment of the invention. Pixel 20 ″ has all the elements of the pixel 20 shown in FIG. 3 , including a transfer gate 32 (TG), reset transistor 34 , source follower transistor 36 , row select transistor 38 , photosensor 40 (PD), and floating diffusion region 50 ″ (FD). The 6T pixel 20 ″ in FIG. 10 includes two booster switches, booster switch A 71 (BSA) and booster switch B 72 (BSB). [0062] The operation of the 6 T pixel 20 embodiment is depicted in FIGS. 11A-11D . In a first step, an exemplary level of charge is generated and accumulated by the photosensor 40 (PD), as shown in FIG. 11A . The transfer gate 32 (TG) is off and a first voltage is applied to both booster switches 71 (BSA) and 72 (BSB). The voltage turns the booster switches 71 (BSA) and 72 (BSB) on, providing the floating diffusion region 50 (FD) with a combined capacitance, including its own capacitance and the intrinsic capacitances of the booster switches 71 (BSA) and 72 (BSB). When the transfer gate 32 (TG) is switched on, the charge is transferred from the photosensor 40 (PD), through the transfer gate 32 (TG), and into the booster switches 71 (BSA) and 72 (BSB) and floating diffusion region 50 (FD), as shown in FIG. 11B . A small amount of charge is also stored in the transfer gate 32 (TG). [0063] The transfer gate 32 (TG) is then switched off, as shown in FIG. 11C , and the residual amount of charge in the channel of the transfer gate 32 (TG) is transferred to the booster switches 71 (BSA) and 72 (BSB) and floating diffusion region 50 (FD). All of the photogenerated charge is stored in the booster switches 71 (BSA) and 72 (BSB) and floating diffusion region 50 (FD) combined. [0064] After the photogenerated charge has been transferred to the booster switch 71 (BSA) and 72 (BSB) and floating diffusion region 50 (FD), as shown in FIG. 11C , the voltage applied to the booster switch B 72 (BSB) may be lowered to a desired level between the first voltage and ground, while the voltage applied to the booster switch A 71 (BSA) may be lowered to a desired level between the voltage applied to the booster switch B 72 (BSB) and ground. In this case, some of the capacitances of the booster switches 71 (BSA) and 72 (BSB) that were being combined with the capacitance of the floating diffusion region 50 (FD) is removed from the combined capacitance, as shown in FIG. 11D . In this illustration, none of the charge is stored in the booster switch A 71 (BSA). Only a small amount of the charge is still stored in the booster switch B 72 (BSB), while most of the charge is stored in the floating diffusion region 50 (FD). At this time, the pixel output reading may be taken. [0065] According to this operation, the output reading is taken when the booster switch gate voltages are lowered to two desired levels, which are designed to create two knees in the charge-voltage profile, as shown in FIG. 12 . The first segment 81 of the charge-voltage profile below the knee reflects the higher conversion gain of the pixel when the charge is at such a low level that it can be entirely stored in the floating diffusion region. The second segment 83 above the first knee reflects a slightly higher level of charge, such that some of the charge is stored in booster switch B as well as the floating diffusion region. The third segment 85 above the second knee reflects an even higher level of charge, such that both booster switch B and the floating diffusion region are full, and some additional charge is stored in booster switch A as well. For example, the readout voltage for the level of light depicted in FIG. 11D would be in the second segment 83 , close to the second knee, since the floating diffusion region is full and the booster switch B is nearly full. As with the 5T pixel of FIGS. 8A-8H , the knee decision point of a 6T pixel can be adjusted by adjusting the decrease in voltage applied to the booster switches A and B. Alternatively, one or both of the booster switches may be used on, off, or at mid-level, such that the 6T pixel behaves as a 5T pixel according to either the two-reading embodiment or the single-reading embodiment of the present invention. [0066] The pixel of the present invention can be used in a pixel array 110 of the imager device 100 illustrated in FIG. 1 . FIG. 13 shows a camera device 200 , a typical processor-based camera device modified to include an imager device 100 ( FIG. 1 ) employing pixels of the present invention as an input device to the device 200 . The imager device 100 may also receive control or other data from camera device 200 as well. [0067] Camera device 200 includes a central processing unit (CPU) 202 that communicates with various devices over a bus 204 . Some of the devices connected to the bus 204 provide communication into and out of the system 200 , illustratively including an input/output (I/O) device 206 and imager device 100 . Other devices connected to the bus 204 provide memory, illustratively including a random access memory system (RAM) 210 , and a peripheral memory device such as FLASH memory 212 . The imager device 100 may be a CCD imager or CMOS imager constructed in accordance with any of the illustrated embodiments. [0068] The camera device 200 may also be included in a processor-based camera system 300 , as illustrated in FIG. 14 . Examples of processor-based camera systems 300 which may employ the camera device 200 , include, without limitation, computer systems, camera systems, scanners, machine vision systems, vehicle navigation systems, video telephones, surveillance systems, auto focus systems, star tracker systems, motion detection systems, image stabilization systems, and others. [0069] System 300 includes a central processing unit (CPU) 302 that communicates with various devices over a bus 304 . Some of the devices connected to the bus 304 provide communication into and out of the system 300 , illustratively including an input/output (I/O) device 306 and camera device 200 . Other devices connected to the bus 304 provide memory, illustratively including a random access memory system (RAM) 310 , hard drive 312 , and one or more peripheral memory devices such as a floppy disk drive 314 and compact disk (CD) drive 316 . The camera device 200 may be combined with a processor, such as a CPU, digital signal processor, or microprocessor, in a single integrated circuit. [0070] The above description and drawings are only to be considered illustrative of exemplary embodiments which achieve the features and advantages of the invention. Modification of, and substitutions to, specific process conditions and structures can be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be considered as being limited by the foregoing description and drawings, but is only limited by the scope of the appended claims.

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Patent Citations (6)

    Publication numberPublication dateAssigneeTitle
    US-2004036784-A1February 26, 2004Bock Nikolai E.High dynamic range pixel with gain and true shutter capability
    US-2004223065-A1November 11, 2004Isao TakayanagiWide dynamic range active pixel with knee response
    US-2005012168-A1January 20, 2005Hong Sungkwon C.4T CMOS image sensor with floating diffusion gate capacitor
    US-2005083421-A1April 21, 2005Vladimir Berezin, Richard TsaiDynamic range enlargement in CMOS image sensors
    US-2005092894-A1May 05, 2005Fossum Eric R.High-low sensitivity pixel
    US-6310369-B1October 30, 2001Sony CorporationCharge-to-voltage converter with adjustable conversion factor

NO-Patent Citations (0)

    Title

Cited By (79)

    Publication numberPublication dateAssigneeTitle
    US-9866739-B2January 09, 2018Fotonation Cayman LimitedSystems and methods for transmitting and receiving array camera image data
    US-8279310-B2October 02, 2012Sony CorporationSolid-state imaging device and camera system
    US-2013032692-A1February 07, 2013Symbol Technologies, Inc.Method and apparatus for controlling output of the solid-state imager in a barcode reader
    US-9858673-B2January 02, 2018Fotonation Cayman LimitedSystems and methods for estimating depth and visibility from a reference viewpoint for pixels in a set of images captured from different viewpoints
    US-9743051-B2August 22, 2017Fotonation Cayman LimitedThin form factor computational array cameras and modular array cameras
    US-9519972-B2December 13, 2016Kip Peli P1 LpSystems and methods for synthesizing images from image data captured by an array camera using restricted depth of field depth maps in which depth estimation precision varies
    US-2015021459-A1January 22, 2015Stmicroelectronics (Crolles 2) SasDual conversion gain image sensor cell
    US-9794476-B2October 17, 2017Fotonation Cayman LimitedSystems and methods for controlling aliasing in images captured by an array camera for use in super resolution processing using pixel apertures
    US-9509927-B2November 29, 2016Sony CorporationSolid-state imaging device, method of driving the same, signal processing method for the same, and imaging apparatus
    US-7616231-B2November 10, 2009Goodrich CorporationCMOS active pixel sensor with improved dynamic range and method of operation for object motion detection
    US-9578259-B2February 21, 2017Fotonation Cayman LimitedSystems and methods for reducing motion blur in images or video in ultra low light with array cameras
    US-2016337567-A1November 17, 2016Brillnics Japan Inc.Solid-State Imaging Device, Method for Driving Solid-State Imaging Device, and Electronic Apparatus
    US-2015281612-A1October 01, 2015Sensors Unlimited, Inc.Integrating pixels and methods of operation
    US-2009321799-A1December 31, 2009Velichko Sergey A, Agranov Gennadiy AMethod and apparatus for increasing conversion gain in imagers
    US-8233070-B2July 31, 2012International Business Machines CorporationVariable dynamic range pixel sensor cell, design structure and method
    WO-2014008946-A1January 16, 2014Teledyne Dalsa B.V.Method of reading out a cmos image sensor and a cmos image sensor configured for carrying out such method
    US-2014117205-A1May 01, 2014Lg Innotek Co., Ltd.Pixel, pixel array, image sensor including pixel array, and method of driving pixel array
    US-9462164-B2October 04, 2016Pelican Imaging CorporationSystems and methods for generating compressed light field representation data using captured light fields, array geometry, and parallax information
    US-9774789-B2September 26, 2017Fotonation Cayman LimitedSystems and methods for high dynamic range imaging using array cameras
    US-2017302836-A1October 19, 2017Brillnics Japan Inc.Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus
    US-7674648-B2March 09, 2010Eastman Kodak CompanyExtended dynamic range using variable sensitivity pixels
    WO-2006073875-A2July 13, 2006Recon/Optical, Inc.Capteur cmos a pixels actifs a gamme dynamique amelioree et son procede de fonctionnement, procede pour l'identification d'objets en mouvement et reseau hybride a detecteur a infrarouge
    WO-2006073875-A3November 20, 2008Micahel Farrier, Recon Optical IncCapteur cmos a pixels actifs a gamme dynamique amelioree et son procede de fonctionnement, procede pour l'identification d'objets en mouvement et reseau hybride a detecteur a infrarouge
    US-9888194-B2February 06, 2018Fotonation Cayman LimitedArray camera architecture implementing quantum film image sensors
    EP-2966856-A1January 13, 2016Softkinetic Sensors N.V.A high dynamic range pixel and a method for operating it
    US-2016112662-A1April 21, 2016Commissariat à l'Energie Atomique et aux Energies AlternativesImage sensor pixel having multiple sensing node gains
    US-9412206-B2August 09, 2016Pelican Imaging CorporationSystems and methods for the manipulation of captured light field image data
    US-9313428-B2April 12, 2016Imec VzwImaging sensors
    US-9485496-B2November 01, 2016Pelican Imaging CorporationSystems and methods for measuring depth using images captured by a camera array including cameras surrounding a central camera
    US-9749568-B2August 29, 2017Fotonation Cayman LimitedSystems and methods for array camera focal plane control
    US-9800856-B2October 24, 2017Fotonation Cayman LimitedSystems and methods for synthesizing images from image data captured by an array camera using restricted depth of field depth maps in which depth estimation precision varies
    US-2008231727-A1September 25, 2008Compton John T, Guidash R MichaelExtended dynamic range using variable sensitivity pixels
    US-2006146161-A1July 06, 2006Recon/Optical, Inc.CMOS active pixel sensor with improved dynamic range and method of operation for object motion detection
    US-9521416-B1December 13, 2016Kip Peli P1 LpSystems and methods for image data compression
    US-9712759-B2July 18, 2017Fotonation Cayman LimitedSystems and methods for generating depth maps using a camera arrays incorporating monochrome and color cameras
    US-2010245644-A1September 30, 2010International Business Machines CorporationVariable dynamic range pixel sensor cell, design structure and method
    US-9811753-B2November 07, 2017Fotonation Cayman LimitedSystems and methods for encoding light field image files
    US-9706132-B2July 11, 2017Fotonation Cayman LimitedCamera modules patterned with pi filter groups
    US-9733486-B2August 15, 2017Fotonation Cayman LimitedSystems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing
    WO-2016005332-A1January 14, 2016Softkinetic Sensors NvA high dynamic range pixel and a method for operating it
    US-9374512-B2June 21, 2016Pelican Imaging CorporationThin form factor computational array cameras and modular array cameras
    US-9754422-B2September 05, 2017Fotonation Cayman LimitedSystems and method for performing depth based image editing
    US-2015365615-A1December 17, 2015Sony CorporationSolid-state imaging device, method of driving the same, signal processing method for the same, and imaging apparatus
    US-9536166-B2January 03, 2017Kip Peli P1 LpSystems and methods for decoding image files containing depth maps stored as metadata
    US-9407795-B2August 02, 2016Teledyne Dalsa B.V.Method of reading out a CMOS image sensor and a CMOS image sensor configured for carrying out such method
    US-9774831-B2September 26, 2017Fotonation Cayman LimitedThin form factor computational array cameras and modular array cameras
    US-9736411-B2August 15, 2017Commissariat à l'Eneragie Atomique et aux Energies AlternativesImage sensor pixel having multiple sensing node gains
    CN-102957880-AMarch 06, 2013北京思比科微电子技术股份有限公司Active pixel, high-dynamic range image sensor and method for operating active pixel
    EP-2150038-A3May 30, 2012Omnivision Technologies, Inc.Image sensor pixel with gain control
    US-9590127-B2March 07, 2017Stmicroelectronics (Crolles 2) SasDual conversion gain image sensor cell
    US-9497370-B2November 15, 2016Pelican Imaging CorporationArray camera architecture implementing quantum dot color filters
    WO-2008133861-A1November 06, 2008Eastman Kodak CompanyPixel de capteur d'image avec commande de gain
    US-2013141619-A1June 06, 2013Samsung Electronics Co., Ltd.Image sensors and image processing devices including the same
    US-9576369-B2February 21, 2017Fotonation Cayman LimitedSystems and methods for generating depth maps using images captured by camera arrays incorporating cameras having different fields of view
    US-9813616-B2November 07, 2017Fotonation Cayman LimitedFeature based high resolution motion estimation from low resolution images captured using an array source
    US-9361662-B2June 07, 2016Pelican Imaging CorporationSystems and methods for synthesizing high resolution images using images captured by an array of independently controllable imagers
    US-9800859-B2October 24, 2017Fotonation Cayman LimitedSystems and methods for estimating depth using stereo array cameras
    US-9497429-B2November 15, 2016Pelican Imaging CorporationExtended color processing on pelican array cameras
    US-8686338-B2April 01, 2014Symbol Technologies, Inc.Method and apparatus for controlling output of the solid-state imager in a barcode reader
    US-7551059-B2June 23, 2009Goodrich CorporationHybrid infrared detector array and CMOS readout integrated circuit with improved dynamic range
    US-2009073279-A1March 19, 2009Sony CorporationSolid-state imaging device and camera system
    WO-2008115500-A3January 15, 2009Eastman Kodak Co, Compton John Thomas, Robert Michael GuidashGamme dynamique étendue utilisant des pixels de sensibilité variable
    US-2006146159-A1July 06, 2006Recon/Optical, Inc.CMOS active pixel sensor with improved dynamic range and method of operation
    US-9686490-B2June 20, 2017Sensors Unlimited, Inc.Integrating pixels and methods of operation
    US-7518645-B2April 14, 2009Goodrich Corp.CMOS active pixel sensor with improved dynamic range and method of operation
    US-2015319384-A1November 05, 2015Canon Kabushiki KaishaSolid-state imaging device and method of driving the same
    US-9019410-B2April 28, 2015Samsung Electronics Co., Ltd.Image sensors comprising photodiodes and image processing devices including the same
    US-9749547-B2August 29, 2017Fotonation Cayman LimitedCapturing and processing of images using camera array incorperating Bayer cameras having different fields of view
    US-9807382-B2October 31, 2017Fotonation Cayman LimitedSystems and methods for detecting defective camera arrays and optic arrays
    US-2003227039-A1December 11, 2003Tomoyuki Umeda, Nobuo Nakamura, Ryoji Suzuki, Hiroaki FujitaSolid-state image pickup device
    US-2006181627-A1August 17, 2006Recon/Optical, Inc.Hybrid infrared detector array and CMOS readout integrated circuit with improved dynamic range
    US-9813617-B2November 07, 2017Fotonation Cayman LimitedArray camera configurations incorporating constituent array cameras and constituent cameras
    US-9253380-B2February 02, 2016Pelican Imaging CorporationThin form factor computational array cameras and modular array cameras
    EP-2721431-A4May 06, 2015Forstgarten Internat Holding GmbhDigitale röntgenbildsensorvorrichtung
    US-2009146981-A1June 11, 2009Chi-Wen Chen, Ming-Sheng Lai, Min-Feng Chiang, Po-Yuan LiuLight detection system and related method
    US-9210392-B2December 08, 2015Pelican Imaging CoporationCamera modules patterned with pi filter groups
    US-2013147979-A1June 13, 2013Pelican Imaging CorporationSystems and methods for extending dynamic range of imager arrays by controlling pixel analog gain
    CN-104394338-AMarch 04, 2015北京思比科微电子技术股份有限公司扩展动态范围的三晶体管图像传感器像素结构
    US-9766380-B2September 19, 2017Fotonation Cayman LimitedSystems and methods for manufacturing camera modules using active alignment of lens stack arrays and sensors